化合物Compound 3444（鍍錫中間體）

詳細(xì)參數(shù)

化合物Compound 3444（鍍錫中間體）

Compound 3444是Solderex TB硫酸鹽型光亮酸錫的關(guān)鍵中間體。Solderex TB工藝是極光亮硫酸鹽型的鍍錫工藝，鍍層的延展性、可焊性極佳，適用于掛鍍，滾鍍和高速鍍工藝。對于鉛錫PC抗蝕鍍層，它是一種極好的無鉛替代工藝。與其它酸錫工藝相比，Solderex TB適用的范圍更寬，無論開缸還是補(bǔ)加，所用的光劑都很少，這使得工藝成本降低，鍍液穩(wěn)定。通過變換操作參數(shù)，此工藝適用于常規(guī)和高速操作，鍍層極佳的可焊性已被ASTM B678-86試驗(yàn)所證明。
Compound 3444 is a key intermediate of Solderex TB sulfate based bright tin oxide. The Solderex TB process is an aurora bright sulfate type tin plating process, with excellent coating ductility and weldability, suitable for hanging plating, rolling plating, and high-speed plating processes. For lead-tin PC corrosion-resistant coatings, it is an excellent lead-free alternative process. Compared with other tin plating processes, Solderex TB has a wider range of applications, with very few light agents used for both cylinder opening and replenishment, which reduces process costs and stabilizes the plating solution. By changing the operating parameters, this process is suitable for both conventional and high-speed operations, and the excellent weldability of the coating has been proven by ASTM B678-86 tests.
 
產(chǎn)品參數(shù)：
物化性質(zhì)：淺黃色至橙紅色透明液體，PH值2.0~3.5，比重1-1.05g/cm3。
有效物質(zhì)濃度：27%~30%
包裝方式：25kg/桶、200kg/桶；亦可按照客戶要求包裝。
有效期：存放于陰涼干燥處，有效期2年。
 
用途：
電鍍用中間體，硫酸型光亮鍍錫低區(qū)走位劑。
此文章來自：金騰龍化工(true3g.com)